Chemtronics - Soder-Wick No Clean Desoldering Braid - 80-3-10

The Chemtronics Soder-Wick No Clean Desoldering Braid is designed for the fast and safe removal of...

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OnBuy.comChemtronics - Soder-Wick No Clean Desoldering Braid Green Label 2.0Mm X 1.5M 3341854112660
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Product Information

Full details

The Chemtronics Soder-Wick No Clean Desoldering Braid is designed for electronics technicians and hobbyists who require efficient, reliable solder removal from printed circuit boards. Its key benefit is a patented, non-corrosive, halide-free flux that significantly accelerates desoldering time while leaving the board residue-free. While it offers superior speed and precision, users should note the specific 1.9mm width is optimized for medium-sized pads and may require different widths for exceptionally small or large solder joints.

All features

Model Part Number60-3-5
BrandChemtronics

Extended Product Information

FAQs

Does this braid require cleaning after use?

No, it features a no-clean flux formula that is non-corrosive and does not need to be removed.

Is this braid ESD-safe?

Yes, it is packaged in static-dissipative bobbins to minimize the risk of ESD damage.

What is the width of this specific braid?

This product (80-3-10) is 1.9mm wide.

Can I use this on lead-free solder?

Yes, the high thermal conductivity of the copper braid makes it effective for both leaded and lead-free solder alloys.

Why is the braid turning black?

This is likely oxidation caused by exposure to air. Keep the braid stored in its original packaging to maintain its effectiveness.

Troubleshooting

Braid is not absorbing solder

Ensure the soldering iron is at the correct temperature and that the braid is not oxidized. If it is dull or dark in color, trim the end of the braid.

Solder bridge persists

Apply a small amount of flux to the joint first or use a wider braid if the joint is too large for the 1.9mm width.

Braid sticks to the pad

Do not pull on the braid while the solder is cooling. Wait until the solder has fully solidified or re-heat slightly before lifting.

Pros and Cons

Pros

  • Significantly faster wicking action than standard braids
  • No-clean formula eliminates the need for solvent rinsing
  • Non-corrosive flux prevents long-term board degradation
  • ESD-safe packaging protects sensitive microelectronics
  • Consistent thermal transfer for clean solder joints

Cons

  • Specific 1.9mm width may not cover all component sizes
  • Must be kept in a dry environment to prevent oxidation
  • More expensive than generic, non-fluxed copper braid

Setup, Compatibility & Care

To ensure optimal performance, keep the braid stored in its original static-dissipative bobbin when not in use, as high humidity and moisture in the air can cause the copper to oxidize, which reduces wicking efficiency. Ensure your soldering iron tip is clean and tinned before use to facilitate the best heat transfer to the braid. The 1.9mm width is highly compatible with standard through-hole components, DPAK packages, and medium-density SMD pads. For cleaning, avoid using harsh chemicals; if the board surface must be cleaned for cosmetic reasons, a light isopropyl alcohol wash is sufficient, though the flux is designed to be left on the board safely.

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